LENOVO Processor ThinkSystem SR570 Intel Xeon Gold 5118 - 2.3 GHz - 12-core - 24 threads - 16.5 MB cache

Redcorp# M852HR34 Article# 4XG7A07230
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Processor LENOVO Processor ThinkSystem SR570 Intel Xeon Gold 5118 - 2.3 GHz - 12-core - 24 threads - 16.5 MB cache
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For the SR570 server models that come standard with one processor, the second processor can be ordered, if required. The second processor must be of the same model as the first processor. The second processor option includes a processor, a heatsink, and two additional single-rotor system fans.

Specs
Processor
Processor generation
1st Generation Intel® Xeon® Scalable
Processor model
5118
Processor base frequency
2.3 GHz
Processor family
Intel® Xeon® Gold
Processor cores
12
Processor socket
LGA 3647 (Socket P)
Component for
Server/workstation
Processor lithography
14 nm
Processor series
Intel Xeon Gold 5000 Series
Processor threads
24
Processor operating modes
64-bit
Processor boost frequency
3.2 GHz
Processor cache
16.5 MB
Processor cache type
L3
Thermal Design Power (TDP)
105 W
Stepping
M0
Processor codename
Skylake
Memory
Maximum internal memory supported by processor
768 GB
Memory types supported by processor
DDR4-SDRAM
Memory clock speeds supported by processor
2666 MHz
Memory channels
Hexa-channel
ECC
Yes
Graphics
On-board graphics card
No
Features
Execute Disable Bit
Yes
Market segment
Server
Maximum number of PCI Express lanes
48
PCI Express slots version
3.0
Supported instruction sets
AVX, AVX 2.0, AVX-512, SSE4.2
Scalability
S4S
Embedded options available
Yes
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)
Yes
Intel® Turbo Boost Technology
2.0
Intel® AES New Instructions (Intel® AES-NI)
Yes
Enhanced Intel SpeedStep Technology
Yes
Intel Trusted Execution Technology
Yes
Intel® Speed Shift Technology
Yes
Intel VT-x with Extended Page Tables (EPT)
Yes
Intel TSX-NI
Yes
Intel 64
Yes
Intel Virtualization Technology (VT-x)
Yes
Intel Virtualization Technology for Directed I/O (VT-d)
Yes
Conflict-Free processor
Yes
Intel Turbo Boost Max Technology 3.0
No
Intel® Optane™ Memory Ready
No
Intel® vPro™ Platform Eligibility
Yes
Operational conditions
Tcase
81 °C
Weight & dimensions
Processor package size
76.0 x 56.5 mm


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