Fanless Shuttle Box-PC with Intel Core ULV processor in a robust chassis
Shuttle's new generation BPCWL02/03 IPC Series in a ruggedized box design for high durability consists of compact fanless IPC systems with modular expansion for wide-range industrial applications. The model BPCWL03 supports an extended operating temperature range of -20 to +60 °C. The Shuttle Box-PC series is offered as a complete system: either as a fixed configuration or as an customized BTO system.